SpecificationsDocumentsDescriptionDimensions
Application | | Flow Soldering |
Brand | | AMP |
Centerline (mm (in)) | | 1.91 [0.075] |
Contact Material | | Brass |
Contact Mating Area Plating Material | | Gold (30) over Nickel (50) |
Gasket | | Without |
GovernmentIndustry Qualification | | No |
Housing Material | | Diallyl Phthalate |
Hybrid | | No |
Jackscrews | | Without |
Lead Free Solder Processes | | Not reviewed for lead free solder process |
Mount Angle | | Vertical |
Number of Positions | | 80 |
Number of Rows | | 2 |
PCB Mount Style | | Thru Hole |
Pin Protection | | With |
Post Size (mm in) | | 0.64 [.025] |
Post Styles | | Card Extender Contact |
Product Type | | Pin Header Assembly |
RoHSELV Compliance | | Not reviewed for ELV/RoHS compliance |
Sealed | | No |
Solder Tail Contact Plating | | Tin-Lead over Nickel |
Stabilizers | | Without |
Staggered Rows | | No |
Strain Relief | | Without |
Termination (Solder) Post Length (mm (in)) | | 5.46 [0.215] |