HDB³ High Density Connectors

This new connector series incorporates a higher density contact pattern and lower mated height than Amphenol’s original Low Mating Force rectangular connectors while utilizing the same durable and reliable B3 contact.

The B3 brush (bristle brush bunch) contact is comprised of multiple strands of high tensile wire that intermesh to create an electrical connection.

Features and Benefits:

• High density contact pattern: .070” x .060” grid spacing
• Low mated height: .500 from mother board to row A of daughter board
• Utilizes the high performance brush contact system for reliability in harsh environments
• Mounting hardware, keys and guide pins have been combined to occupy less board space
• Available in the following contact arrangements: 40, 80, 120, or 160
• Configurable for data rates up to 3.125 Gbps data rates per differential pair
• RoHS compliant version available

HDB³ and HSB³ Connector Series Catalog (2 MB)
HDB³ High Density Connectors Data Sheet