SpecificationsDocumentsDescriptionDimensions
| Board Standoff | | With |
| Brand | | AMP |
| Centerline Matrix (mm (in)) | | 2.54 x 2.54 [.100 x .100] |
| Closed Entry | | Without |
| Comment | | With hex mounting ears. |
| Connector Height (mm (in)) | | 6.05 [0.238] |
| Connector Series | | Mod II |
| Contact Material | | Phosphor Bronze |
| Contact Mating Area Plating Material | | Gold (50) |
| GovernmentIndustry Qualification | | No |
| High Temperature Compatible | | No |
| Holddown Feature | | Without |
| Housing Entry Style | | Side |
| Housing Material | | Polyphenylene Sulfide |
| Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| Mount Angle | | Right Angle |
| Mounting Pattern (mm (in)) | | 2.54 x 7.87 [.100 x .310] |
| Number of Positions | | 170 |
| Number of Rows | | Dual |
| PCB Retention Feature | | No |
| Product Type | | Receptacle |
| Profile | | Standard |
| RoHSELV Compliance | | RoHS compliant, ELV compliant |
| RoHSELV Compliance History | | Always was RoHS compliant |
| Sealed | | No |
| Solder Tail Contact Plating | | Gold Flash over Nickel |
| Stackable | | No |
| Termination (Solder) Post Length (mm in) | | 2.92 [0.115] |
| Termination Method | | Through Hole |