SpecificationsDocumentsDescriptionDimensions
Brand | | AMP |
Center-to-Center Spacing (mm (in)) | | 4.32 [0.17] |
Contact Material | | Beryllium Copper |
Contact Mating Area Plating Material | | Gold |
Dielectric Material | | TFE Fluorocarbon |
Housing Material | | Stainless Steel |
Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
Mount | | Through-Hole |
Mount Angle | | Right Angle |
Mount Type | | PC Board |
Product Type | | Connector |
RoHSELV Compliance | | RoHS compliant, ELV compliant |
RoHSELV Compliance History | | Always was RoHS compliant |
Termination Type | | Printed Circuit Board |