SpecificationsDocumentsDescriptionDimensions
Board-to-Board Stack Height (mm (in)) | | 14.00 [0.551], 15.00 [0.590] |
Brand | | AMP |
Centerline (mm (in)) | | 1.00 [0.039] |
Comment | | IEEE 1386 Mezzanine Connector. |
Contact Layout | | In-Line |
Contact Material | | Copper Alloy |
Contact Mating Area Plating Material | | Gold (50) |
Family Name | | Free Height |
Gender | | Receptacle |
Grounding Contact | | Without |
Grounding Plate | | Without |
Housing Color | | Black |
Housing Flammability Rating | | UL 94V-0 |
Housing Material | | High Temperature Thermoplastic |
Housing Material Temperature | | High |
Keyed | | No |
Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
Locating Post(s) | | Without |
Number of Positions | | 64 |
Number of Rows | | Dual |
Packaging Method | | Tape & Reel |
PCB Mount Angle | | Vertical |
RoHSELV Compliance | | ELV compliant, 5 of 6 Compliant |
Solder Tail Contact Plating | | Tin-Lead over Nickel |
Vacuum Cover | | With |