SpecificationsDocumentsDescriptionDimensions
| Brand | | AMP |
| Contact Mating Area Plating Material | | Gold |
| Contact Mating Area Plating Thickness | | 30 Microinches |
| Contact Termination Type | | Surface Mount |
| Gender | | Receptacle |
| Housing Color | | Black |
| Lead Free Solder Processes | | Reflow solder capable to 245°C, Reflow solder capable to 260°C |
| Locating Post(s) | | Without |
| Locking Feature | | Without |
| Mount Location | | Top |
| Number of Ports | | 1 |
| Number of Positions | | 5 |
| Orientation | | Right Angle |
| Packaging Method | | Tape & Reel |
| Panel Ground | | Without |
| PCB Retention Method | | SMT Hold Down |
| PCB Thickness (mm in) | | 1.57 [0.062] |
| Pick and Place Cover | | Without |
| RoHSELV Compliance | | RoHS compliant, ELV compliant |
| RoHSELV Compliance History | | Always was RoHS compliant |
| Series | | B |
| Shell Plating | | Half-Bright Tin over Copper |
| Size | | Mini |
| Terminate To | | Printed Circuit Board |
| Termination Method | | Solder to PC Board |
| TID Number | | 61000453 |