SpecificationsDocumentsDescriptionDimensions
| Blindmate | | No |
| Brand | | AMP |
| Comment | | For solder dip product see part number 1218434-7. |
| Contact Material | | Brass or Beryllium Copper |
| Contact Mating Area Plating Material | | Gold |
| Contact Size | | 20 |
| Density | | Standard |
| Gender | | Receptacle |
| GovernmentIndustry Part Number | | M24308/23-26F |
| GovernmentIndustry Qualification | | No |
| Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| Mount Style | | Mounting Holes |
| Mounting Hole Diameter (mm (in)) | | 2.92-3.18 [.115-.125] |
| NASA Qualification | | No |
| Non-Magnetic | | No |
| Number of Positions | | 15 |
| PCB Mount Angle | | Right Angle |
| Post Diameter (mm (in)) | | 0.76 [0.030] |
| PowerSignalCoax Combination | | No |
| Product Series | | 109 |
| Product Type | | Connector |
| Rear Grommet | | No |
| RoHSELV Compliance | | Not ELV/RoHS compliant |
| Shell Material | | Steel |
| Shell Plating | | Cadmium |
| Shell Size | | 2 |
| Sockets | | With |
| Solder Tail Contact Plating | | Nickel |
| Terminate To | | Printed Circuit Board |
| Termination (Solder) Post Length (mm in) | | 3.18 [0.125] |