SpecificationsDocumentsDescriptionDimensions
Body Finish | | Gold |
Body Material | | Stainless Steel |
Body Style | | Straight |
Brand | | AMP |
Center Contact Material | | Beryllium Copper |
Center Contact Plating | | Gold |
Dielectric Material | | TFE Fluorocarbon |
Frequency | | DC - 18 GHz |
Gender | | Plug |
Impedance (Nominal) (Ω) | | 50 |
Insulation Resistance (MΩ) | | 5,000 |
Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
O-Ring Material | | Fluorosilicone |
Panel Attachment | | Without |
Product Line | | OSP Miniature Modular |
Product Type | | Connector |
RoHSELV Compliance | | RoHS compliant, ELV compliant |
RoHSELV Compliance History | | Always was RoHS compliant |
Sealed | | No |
Terminal Style | | Surface Mount |
Terminate To | | Printed Circuit Board |