SpecificationsDocumentsDescriptionDimensions
Brand | | AMP |
Contact Mating Area Plating Material | | Gold |
Contact Mating Area Plating Thickness | | 30 Microinches |
Contact Termination Type | | Surface Mount |
Gender | | Receptacle |
Housing Color | | Black |
Lead Free Solder Processes | | Reflow solder capable to 245°C, Reflow solder capable to 260°C |
Locating Post(s) | | With |
Locking Feature | | Without |
Mount Location | | Top |
Number of Ports | | 1 |
Number of Positions | | 5 |
Orientation | | Right Angle |
Packaging Method | | Tape & Reel |
Panel Ground | | Without |
PCB Retention Method | | SMT Hold Down |
PCB Thickness (mm in) | | 1.57 [0.062] |
Pick and Place Cover | | Without |
RoHSELV Compliance | | RoHS compliant, ELV compliant |
RoHSELV Compliance History | | Always was RoHS compliant |
Series | | B |
Shell Plating | | Half-Bright Tin over Copper |
Size | | Mini |
Terminate To | | Printed Circuit Board |
Termination Method | | Solder to PC Board |
TID Number | | 61000453 |