Brand | | AMP |
Centerline Matrix (mm (in)) | | 2.00 x 2.00 [.079 x .079] |
Comment | | With sequenced contacts. Refer to customer drawing for specific loading pattern |
Contact Material | | Phosphor Bronze |
Contact Mating Area Plating Material | | Gold (30) |
Housing Material | | Liquid Crystal Polymer (LCP) |
Lead Free Solder Processes | | Not relevant for lead free process |
Module Type | | Signal |
Number of Rows | | 5 |
Number of Signal Positions | | 120 |
PCB Mount Angle | | Vertical |
Pin Header Width (mm (in)) | | 17.80 [0.701] |
Post Plating | | Tin |
Post Type | | Press-Fit |
Press-Fit Post Style | | Compliant Pin |
Product Type | | Fixed-Board (Header) |
RoHSELV Compliance | | RoHS compliant, ELV compliant |
RoHSELV Compliance History | | Always was RoHS compliant |
Selectively Loaded | | Yes |
Sequencing | | Yes |
Sequencing Configuration Row A | | Blank, Mating Post Length 5.75mm, Termination Post Length 4.25mm |
Sequencing Configuration Row B | | Blank, Mating Post Length 5.75mm, Termination Post Length 4.25mm |
Sequencing Configuration Row C | | Blank, Mating Post Length 5.75mm, Termination Post Length 4.25mm |
Sequencing Configuration Row D | | Blank, Mating Post Length 5.75mm, Termination Post Length 4.25mm |
Sequencing Configuration Row E | | Blank, Mating Post Length 5.75mm, Termination Post Length 4.25mm |
Voltage Rating (VAC) | | 30 |