SpecificationsDocumentsDescriptionDimensions
Brand | | AMP |
Contact Mating Area Plating Material | | Gold or Gold Flash over Palladium Nickel |
Contact Mating Area Plating Thickness | | 30 Microinches |
Contact Termination Type | | Through Hole |
Gender | | Receptacle |
Housing Color | | Black |
Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
Locating Post(s) | | Without |
Locking Feature | | Without |
Mount Location | | Top |
Number of Ports | | 1 |
Number of Positions | | 4 |
Orientation | | Right Angle |
Packaging Method | | Tray |
Panel Ground | | Without |
PCB Retention Method | | Kinked Legs |
PCB Thickness (mm (in)) | | 1.57 [0.062] |
Pick and Place Cover | | Without |
RoHSELV Compliance | | RoHS compliant, ELV compliant |
RoHSELV Compliance History | | Always was RoHS compliant |
Series | | B |
Shell Plating | | Bright Tin over Nickel |
Size | | Standard |
Tail Length (mm in) | | 3.01 [0.119] |
Terminate To | | Printed Circuit Board |
Termination Method | | Solder to PC Board |
TID Number | | 60001134 |