SpecificationsDocumentsDescriptionDimensions
| Board-to-Board Stack Height (mm in) | | 4.00 [0.157], 5.00 [0.197], 8.00 [0.315] |
| Brand | | AMP |
| Centerline (mm (in)) | | 0.50 [0.0197] |
| Comment | | COM Express |
| Contact Layout | | In-Line |
| Contact Material | | Copper Alloy |
| Contact Mating Area Plating Material | | Gold (8) |
| Family Name | | Free Height |
| Gender | | Receptacle |
| Grounding Contact | | With |
| Grounding Plate | | Without |
| Height | | 4H |
| Housing Color | | Black |
| Housing Flammability Rating | | UL 94V-0 |
| Housing Material | | High Temperature Thermoplastic |
| Housing Material Temperature | | High |
| Keyed | | Yes |
| Lead Free Solder Processes | | Reflow solder capable to 245°C |
| Locating Post(s) | | With |
| Number of Positions | | 440 |
| Number of Rows | | Dual |
| Packaging Method | | Hard Tray |
| PCB Mount Angle | | Vertical |
| RoHSELV Compliance | | RoHS compliant, ELV compliant |
| RoHSELV Compliance History | | Always was RoHS compliant |
| Sealant | | Without |
| Solder Tail Contact Plating | | Gold over Nickel |
| Vacuum Cover | | With |