SpecificationsDocumentsDescriptionDimensions
| Board-to-Board Stack Height (mm (in)) | | 8.00 [0.315], 9.00 [0.354], 10.00 [0.394] |
| Brand | | AMP |
| Centerline (mm (in)) | | 1.00 [0.039] |
| Comment | | IEEE 1386 Mezzanine Connector. |
| Contact Layout | | In-Line |
| Contact Material | | Copper Alloy |
| Contact Mating Area Plating Material | | Gold (30) |
| Family Name | | Free Height |
| Gender | | Receptacle |
| Grounding Contact | | Without |
| Grounding Plate | | Without |
| Housing Color | | Black |
| Housing Flammability Rating | | UL 94V-0 |
| Housing Material | | High Temperature Thermoplastic |
| Housing Material Temperature | | High |
| Keyed | | No |
| Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| Locating Post(s) | | With |
| Number of Positions | | 64 |
| Number of Rows | | Dual |
| Packaging Method | | Tape & Reel |
| PCB Mount Angle | | Vertical |
| RoHSELV Compliance | | RoHS compliant, ELV compliant |
| RoHSELV Compliance History | | Always was RoHS compliant |
| Solder Tail Contact Plating | | Tin over Nickel |
| Vacuum Cover | | With |