SpecificationsDocumentsDescriptionDimensions
Board-to-Board Stack Height (mm (in)) | | 13.00 [0.512], 14.00 [0.551], 15.00 [0.590], 16.00 [0.630] |
Brand | | AMP |
Centerline (mm (in)) | | 0.80 [0.031] |
Contact Layout | | In-Line |
Contact Material | | Beryllium Copper |
Contact Mating Area Plating Material | | Gold (30) |
Family Name | | Free Height |
Gender | | Receptacle |
Grounding Contact | | Without |
Grounding Plate | | Without |
Height | | 13H |
Housing Color | | Natural |
Housing Flammability Rating | | UL 94V-0 |
Housing Material | | Liquid Crystal Polymer (LCP) |
Housing Material Temperature | | High |
Keyed | | Yes |
Lead Free Solder Processes | | Reflow solder capable to 245°C, Reflow solder capable to 260°C |
Locating Post(s) | | With |
Number of Positions | | 80 |
Number of Rows | | Dual |
Packaging Method | | Tube |
PCB Mount Angle | | Vertical |
RoHSELV Compliance | | RoHS compliant, ELV compliant |
RoHSELV Compliance History | | Always was RoHS compliant |
Solder Tail Contact Plating | | Tin over Nickel |
Vacuum Cover | | Without |