SpecificationsDocumentsDescriptionDimensions
| Board-to-Board Stack Height (mm (in)) | | 13.00 [0.512], 14.00 [0.551], 15.00 [0.590], 16.00 [0.630] |
| Brand | | AMP |
| Centerline (mm (in)) | | 0.80 [0.031] |
| Contact Layout | | In-Line |
| Contact Material | | Beryllium Copper |
| Contact Mating Area Plating Material | | Gold (30) |
| Family Name | | Free Height |
| Gender | | Receptacle |
| Grounding Contact | | Without |
| Grounding Plate | | Without |
| Height | | 13H |
| Housing Color | | Natural |
| Housing Flammability Rating | | UL 94V-0 |
| Housing Material | | Liquid Crystal Polymer (LCP) |
| Housing Material Temperature | | High |
| Keyed | | Yes |
| Lead Free Solder Processes | | Reflow solder capable to 245°C, Reflow solder capable to 260°C |
| Locating Post(s) | | With |
| Number of Positions | | 180 |
| Number of Rows | | Dual |
| Packaging Method | | Tube |
| PCB Mount Angle | | Vertical |
| RoHSELV Compliance | | RoHS compliant, ELV compliant |
| RoHSELV Compliance History | | Always was RoHS compliant |
| Solder Tail Contact Plating | | Tin over Nickel |
| Vacuum Cover | | Without |