SpecificationsDocumentsDescriptionDimensions
| Brand | | AMP |
| Contact Mating Area Plating Material | | Gold or Gold Flash over Palladium Nickel |
| Contact Mating Area Plating Thickness | | 30 Microinches |
| Contact Termination Type | | Through Hole |
| Gender | | Receptacle |
| Housing Color | | Black |
| Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| Locating Post(s) | | Without |
| Locking Feature | | Without |
| Mount Location | | Top |
| Number of Ports | | 1 |
| Number of Positions | | 4 |
| Orientation | | Vertical |
| Packaging Method | | Tray |
| Panel Ground | | Without |
| PCB Retention Method | | Kinked Legs |
| PCB Thickness (mm (in)) | | 1.57 [0.062] |
| Pick and Place Cover | | Without |
| RoHSELV Compliance | | RoHS compliant, ELV compliant |
| RoHSELV Compliance History | | Always was RoHS compliant |
| Series | | B |
| Shell Plating | | Bright Tin over Nickel |
| Size | | Standard |
| Tail Length (mm in) | | 3.01 [0.119] |
| Terminate To | | Printed Circuit Board |
| Termination Method | | Solder to PC Board |
| TID Number | | 60000281 |