SpecificationsDocumentsDescriptionDimensions
Body Shape | | C |
Brand | | AMP |
Disconnect Diameter (mm (in)) | | 1.47 [0.058] |
Insulation Diameter (mm (in)) | | 1.14-1.78 [.045-.070] |
Insulation Support | | Yes |
Lead Free Solder Processes | | Not relevant for lead free process |
Material | | Beryllium Copper |
Packaging Method | | Loose Piece |
Plating | | Gold (15) |
Product Type | | Receptacle |
RoHSELV Compliance | | RoHS compliant, ELV compliant |
RoHSELV Compliance History | | Always was RoHS compliant |
Stock Thickness (mm (in)) | | 0.25 [0.010] |
Wire Range (mm (AWG)) | | 0.20-0.60² [24-20] |