SpecificationsDocumentsDescriptionDimensions
Brand | | Tyco Electronics |
Comment | | Mounting clip does not increase overall heat sink height. |
Device Type | | BGA |
Diameter (mm in) | | 50.80 [2.000] |
Fan Type | | No Fan |
Finish | | Black Anodize |
Flammability Rating | | UL 94V-0 |
For Use With | | BGA Semiconductor Packages |
Heat Sink Type | | Pin Fin 3 |
Height (mm (in)) | | 27.94 [1.100] |
Lead Free Solder Processes | | Not relevant for lead free process |
Line | | ChipCoolers |
Material | | Cold-Forged Aluminum |
Package Size (mm in) | | 42.5 [1.675] |
Product Type | | Heat Sink |
RoHSELV Compliance | | RoHS compliant, ELV compliant |
RoHSELV Compliance History | | Always was RoHS compliant |