SpecificationsDocumentsDescriptionDimensions
Application | | Flow Soldering |
Brand | | AMP |
Centerline (mm (in)) | | 1.91 [0.075] |
Contact Material | | Beryllium Copper, Copper-Nickel-Silicon |
Contact Mating Area Plating Material | | Gold over Nickel |
Gasket | | Without |
GovernmentIndustry Qualification | | No |
Housing Material | | Diallyl Phthalate |
Hybrid | | No |
Jackscrews | | Without |
Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
Mount Angle | | Vertical |
Number of Positions | | 110 |
Number of Rows | | 2 |
PCB Mount Style | | Thru Hole |
Pin Protection | | Without |
Post Size (mm in) | | 0.41 x 0.46 [.016 x .018] |
Post Styles | | Posted |
Product Type | | Receptacle Assembly |
RoHSELV Compliance | | ELV compliant |
RoHSELV Compliance History | | Always was ELV compliant |
Sealed | | No |
Solder Tail Contact Plating | | Tin-Lead over Nickel |
Stabilizers | | Without |
Staggered Rows | | Yes |
Strain Relief | | Without |
Termination (Solder) Post Length (mm (in)) | | 3.95 [0.156] |