SpecificationsDocumentsDescriptionDimensions
| Application | | PC Solder Mount |
| Brand | | AMP |
| Centerline (mm (in)) | | 1.27 [0.050] |
| Color | | Gray |
| Contact Material | | Beryllium Copper |
| Contact Mating Area Plating Material | | Gold (50) |
| Gasket | | Without |
| GovernmentIndustry Qualification | | No |
| Housing Material | | Liquid Crystal Polymer (LCP) |
| Hybrid | | No |
| Jackscrews | | Without |
| Lead Free Solder Processes | | Reflow solder capable to 245°C |
| Number of Positions | | 30 |
| Number of Rows | | 2 |
| PCB Mount Style | | Straddle Mount |
| Pin Protection | | Without |
| Post Styles | | Card Extender Contact |
| Product Type | | Receptacle Assembly |
| RoHSELV Compliance | | ELV compliant |
| RoHSELV Compliance History | | Always was ELV compliant |
| Sealed | | No |
| Solder Tail Contact Plating | | Tin-Lead over Nickel |
| Stabilizers | | Without |
| Staggered Rows | | No |
| Strain Relief | | Without |
| Termination (Solder) Post Length (mm (in)) | | 5.08 [0.200] |