SpecificationsDocumentsDescriptionDimensions
Body Plating | | Silver |
Brand | | AMP |
Center Contact Plating | | Silver |
Dielectric Material | | TEFLON |
Gender | | Jack |
Lead Free Solder Processes | | Not relevant for lead free process |
Panel Attachment | | With |
Panel Attachment Method | | Bulkhead |
Panel Thickness (mm (in)) | | 3.18 [0.125] |
Product Type | | Adapter |
RoHSELV Compliance | | Not ELV/RoHS compliant |