SpecificationsDocumentsDescriptionDimensions
| Body Plating | | Silver |
| Brand | | Tyco Electronics |
| Center Contact Plating | | Silver |
| Dielectric Material | | TEFLON |
| Gender | | Jack |
| Lead Free Solder Processes | | Not relevant for lead free process |
| Panel Attachment | | With |
| Panel Attachment Method | | Bulkhead |
| Panel Thickness (mm in) | | 3.18 [0.125] |
| Product Type | | Adapter |
| RoHSELV Compliance | | RoHS compliant, ELV compliant |
| RoHSELV Compliance History | | Always was RoHS compliant |