Board Level Heat Sinks
Adam Tech’s Board Level Heat Sinks ensure optimal device performance by efficiently dissipating heat generated by components on a device’s PCB (printed circuit boards). Composed of aluminum, a highly thermally conductive material, they effectively transfer heat by radiating it into the air, cooling the device. Their large, finned surface area enhances airflow for natural convection heat dissipation, making them ideal for applications requiring temperature regulation. Their lightweight, compact design makes them perfect for applications with limited space, and suitable for common TO-220, TO-247 and SOT-32 component packages. With customizable options and easy installation methods, Adam Tech’s board level heat sinks offer a cost-effective solution for improving thermal performance in various electronic devices.
Key Features
Features
- Extruded and stamped types
- Suitable For TO-220, TO-247, and SOT-32 packaged components
- Material: aluminum
- Surface finish: black anodized
- Vertical PCB mounting options: M2.5 screw, M3 screw, and solder pins
- Mounts directly to component
- Various sizes to meet cooling requirements
- Maximizes heat transfer and enhances cooling efficiency
- Easy installation
Applications
- Power supplies
- Consumer and automotive electronics
- Audio Amplifiers
- Industrial power control systems
- Motor controllers
- Telecommunications equipment
Product Images
Datasheets and Catalogs
Contact your local sales office or email [email protected] for more information.