SpecificationsDocumentsDescriptionDimensions
| | |
Center Post | | With |
Center Post Material | | Liquid Crystal Polymer (LCP) |
Center Retention Hole Diameter | | 2.5 |
Centerline | | 0.6 |
DRAM Type | | Double Data Rate (DDR) III |
DRAM Voltage | | 1.5 V |
Ejector Location | | Both Ends |
Ejector Material | | Liquid Crystal Polymer (LCP) |
Ejector Material Color | | Natural |
Ejector Type | | Standard |
Height Above PC Board | | 9.79 |
Holddown Material | | Copper Alloy |
Holddown Plating | | Tin |
Keying | | Reverse |
Latch Material | | Liquid Crystal Polymer (LCP) |
Locating Post(s) | | With |
Module Orientation | | Right Angle |
Mount Type | | Printed Circuit Board |
Number of Holddowns | | 6.0 |
Number of Keys | | 1.0 |
Number of Positions | | 244 |
Number of Rows | | Dual |
PCB Mount Retention | | With |
PCB Mount Retention Type | | Solder Peg |
PCB Mount Style | | Surface Mount |
Profile | | Standard |
Row-to-Row Spacing | | 8.7 |
Socket Style | | Mini DIMM |
Socket Type | | Memory Card |
Solder Tail Contact Plating | | Gold Flash over Nickel |