SpecificationsDocumentsDescriptionDimensions
Application | | PC Solder Mount |
Brand | | AMP |
Centerline (mm (in)) | | 1.27 [0.050] |
Color | | Gray |
Contact Material | | Beryllium Copper |
Contact Mating Area Plating Material | | Gold (50) |
Gasket | | Without |
GovernmentIndustry Qualification | | No |
Housing Material | | Liquid Crystal Polymer (LCP) |
Hybrid | | No |
Jackscrews | | Without |
Lead Free Solder Processes | | Reflow solder capable to 245°C |
Number of Positions | | 30 |
Number of Rows | | 2 |
PCB Mount Style | | Straddle Mount |
Pin Protection | | Without |
Post Styles | | Card Extender Contact |
Product Type | | Receptacle Assembly |
RoHSELV Compliance | | ELV compliant |
RoHSELV Compliance History | | Always was ELV compliant |
Sealed | | No |
Solder Tail Contact Plating | | Tin-Lead over Nickel |
Stabilizers | | Without |
Staggered Rows | | No |
Strain Relief | | Without |
Termination (Solder) Post Length (mm (in)) | | 5.08 [0.200] |