SpecificationsDocumentsDescriptionDimensions
Brand | | AMP |
Centerline (mm (in)) | | 0.64 [0.025] |
Contact Material | | Copper Alloy |
Contact Mating Area Plating Material | | Gold (30) over Nickel |
Gender | | Plug |
Ground Bus Lead Length (mm in) | | 1.52 [0.060] |
Ground Bus Lead Type | | Barbless |
Ground Bus Material | | Brass |
Ground Bus Mating Area Plating | | Gold (30) |
Ground Bus Terminating Area | | Tin-Lead |
Housing Material | | Liquid Crystal Polymer (LCP) |
Lead Free Solder Processes | | Reflow solder capable to 245°C, Reflow solder capable to 260°C |
Mated Stack Height (Vertical) (mm (in)) | | 10.92 [0.430], 20.00 [0.785] |
Mount Angle | | Vertical |
Number of Positions | | 114 |
Packaging Method | | Pocket Tape |
Product Type | | Connector |
RoHSELV Compliance | | ELV compliant, 5 of 6 Compliant |
Termination End Plating | | Tin-Lead over Nickel |
Vacuum Cover | | With |