SpecificationsDocumentsDescriptionDimensions
| Boardlock Material | | Plastic |
| Brand | | AMP |
| Centerline (mm in) | | 3.00 [0.118] |
| Contact Material | | Brass |
| Contact Mating Area Plating Material | | Matte Tin |
| Housing Color | | Black |
| Housing Flammability Rating | | UL 94V-0 |
| Housing Material | | High Temperature Nylon |
| Lead Free Solder Processes | | Reflow solder capable to 245°C, Reflow solder capable to 260°C |
| Mount Angle | | Right Angle |
| Mount Style | | Through-Hole |
| Mount Type | | PC Board |
| Number of Positions | | 12 |
| Number of Rows | | Dual |
| PCB Retention Method | | Boardlock(s) |
| Polarization | | Without |
| Product Type | | Header Assembly |
| RoHSELV Compliance | | RoHS compliant, ELV compliant |
| RoHSELV Compliance History | | Always was RoHS compliant |
| Solder Tail Contact Plating | | Matte Tin |