SpecificationsDocumentsDescriptionDimensions
| Application | | Flow Soldering |
| Brand | | AMP |
| Centerline (mm in) | | 1.27 [0.050] |
| Color | | Gray |
| Contact Material | | Beryllium Copper |
| Contact Mating Area Plating Material | | Gold (50) |
| Gasket | | Without |
| GovernmentIndustry Part Number | | M55302/119-08 |
| GovernmentIndustry Qualification | | Yes |
| Housing Material | | Liquid Crystal Polymer (LCP) |
| Hybrid | | No |
| Jackscrews | | Without |
| Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| Mount Angle | | Vertical |
| Number of Positions | | 90 |
| Number of Rows | | 2 |
| PCB Mount Style | | Thru Hole |
| Pin Protection | | Without |
| Post Size (mm (in)) | | 0.20 x 0.46 [.008 x .018] |
| Post Styles | | Posted |
| Product Type | | Receptacle Assembly |
| RoHSELV Compliance | | ELV compliant |
| RoHSELV Compliance History | | Always was ELV compliant |
| Sealed | | No |
| Solder Tail Contact Plating | | Tin-Lead over Nickel |
| Stabilizers | | Without |
| Staggered Rows | | Yes |
| Strain Relief | | Without |
| Termination (Solder) Post Length (mm (in)) | | 3.56 [0.140], 4.83 [0.190] |