SpecificationsDocumentsDescriptionDimensions
| Brand | | AMP |
| Contact Material | | Brass |
| Contact Mating Area Plating Material | | Gold Flash over Palladium Nickel or Gold (30) over Nickel |
| Contact Retention in Housing | | Crimp Snap-In |
| Contact Size | | 20 |
| Contact Type | | Solder Cup |
| Grade | | Standard |
| Insulation Support | | No |
| Lead Free Solder Processes | | Not relevant for lead free process |
| Packaging Method | | Loose Piece |
| Packaging Quantity | | 100/Box |
| Pin Diameter (mm in) | | 1.02 [0.040] |
| PinSocket | | Pin |
| Product Series | | HDP-20 (Crimp Snap) |
| Product Type | | Contact |
| RoHSELV Compliance | | RoHS compliant, ELV compliant |
| RoHSELV Compliance History | | Always was RoHS compliant |
| Solder Tail Contact Plating | | Gold Flash over Nickel |
| Used With | | CPC Connectors, AMPLIMITE HDP-20 |
| Wire Range (mm² (AWG)) | | 0.8 - 0.9 [18] |
| Wire Termination Type | | Solder |