SpecificationsDocumentsDescriptionDimensions
| | | |
| Brand | | AMP |
| Centerline | | 0.64 |
| Connector Style | | Receptacle |
| Contact Base Material | | Copper Alloy |
| Contact Plating Mating Area Material | | Gold (5) over Palladium Nickel |
| Ground Bus Lead Length | | 2.74 |
| Ground Bus Lead Type | | Barbless |
| Ground Bus Material | | Phosphor Bronze |
| Ground Bus Mating Area Plating | | Gold (5) over Palladium Nickel |
| Ground Bus Terminating Area | | Tin-Lead |
| Housing Material | | Liquid Crystal Polymer (LCP) |
| Lead Free Solder Processes | | Reflow solder capable to 245°C / Reflow solder capable to 260°C |
| Mated Stack Height (Vertical) | | 6.6 / 9.0 / 10.92 / 12.57 / 17.96 / 18.75 / 20.0 / 22.86 |
| Mount Angle | | Vertical |
| Number of Positions | | 228 |
| Packaging Method | | Tube |
| Product Type | | Connector |
| RoHSELV Compliance | | ELV compliant / 5 of 6 Compliant |
| Termination End Plating | | Tin-Lead over Nickel |
| Vacuum Cover | | Without |