SpecificationsDocumentsDescriptionDimensions
| Approved Standards | | UL E28476, CSA LE7189 |
| Board Standoff | | Without |
| Brand | | AMP |
| Centerline Matrix (mm (in)) | | 2.54 x 2.54 [.100 x .100] |
| Connector Type | | Stacking |
| Contact Current Rating (Amps.) | | 3 |
| Contact Material | | Copper Alloy |
| Contact Mating Area Plating Material | | Gold (15) |
| Dielectric Withstanding Voltage (V) | | 750 |
| Housing Color | | Black |
| Housing Material | | Thermoplastic |
| Insulation Resistance (MΩ) | | 5,000 |
| Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| Mating Post Length (mm (in)) | | 8.38 [0.330] |
| Number of Positions | | 70 |
| Number of Rows | | Dual |
| Operating Temperature (°C) | | -65 – +125 |
| PCB Retention Feature | | No |
| Product Type | | Header |
| RoHSELV Compliance | | RoHS compliant, ELV compliant |
| RoHSELV Compliance History | | Always was RoHS compliant |
| Solder Tail Contact Plating | | Tin (100) over Nickel (50) |
| Stack Height (mm in) | | 15.24 [0.600] |
| Surface Mount Compatible | | No |
| Termination (Solder) Post Length (mm (in)) | | 26.16 [1.030] |