SpecificationsDocumentsDescriptionDimensions
Application Type | | DDR SDRAM |
Boss | | Without |
Brand | | AMP |
Center Key (mm in) | | None |
Centerline (mm in) | | 0.60 [0.024] |
Contact Material | | Copper Alloy |
Contact Mating Area Plating Material | | Gold Flash |
Contact Mount | | Surface Mount |
DRAM Type | | Double Data Rate (DDR) |
DRAM Voltage | | 1.8 V |
Ejector Location | | Both Ends |
Ejector Type | | Locking |
Housing Color | | Black |
Housing Flammability Rating | | UL 94V-0 |
Housing Material | | High Temperature Thermoplastic |
Insertion Style | | Cam-In |
Keying | | Standard |
Latch Material | | Stainless Steel |
Lead Free Solder Processes | | Reflow solder capable to 245°C |
Module Orientation | | Right Angle |
Number of Keys | | 1 |
Number of Positions | | 200 |
Number of Rows | | Dual |
Packaging Method | | Semi-Hard Tray Assembly |
Packaging Quantity | | 20 |
Product Type | | SO DIMM |
Profile | | Low |
RoHSELV Compliance | | RoHS compliant, ELV compliant |
RoHSELV Compliance History | | Always was RoHS compliant |
Row-to-Row Spacing (mm (in)) | | 5.60 [0.220] |
Solder Tail Contact Plating | | Gold Flash |
Stack Height (mm in) | | 4.00 [0.157] |