SpecificationsDocumentsDescriptionDimensions
| | | |
| Center Post | | With |
| Center Post Material | | Liquid Crystal Polymer (LCP) |
| Center Retention Hole Diameter | | 2.5 |
| Centerline | | 0.6 |
| DRAM Type | | Double Data Rate (DDR) III |
| DRAM Voltage | | 1.5 V |
| Ejector Location | | Both Ends |
| Ejector Material | | Liquid Crystal Polymer (LCP) |
| Ejector Material Color | | Natural |
| Ejector Type | | Standard |
| Height Above PC Board | | 9.79 |
| Holddown Material | | Copper Alloy |
| Holddown Plating | | Tin |
| Keying | | Reverse |
| Latch Material | | Liquid Crystal Polymer (LCP) |
| Locating Post(s) | | With |
| Module Orientation | | Right Angle |
| Mount Type | | Printed Circuit Board |
| Number of Holddowns | | 6.0 |
| Number of Keys | | 1.0 |
| Number of Positions | | 244 |
| Number of Rows | | Dual |
| PCB Mount Retention | | With |
| PCB Mount Retention Type | | Solder Peg |
| PCB Mount Style | | Surface Mount |
| Profile | | Standard |
| Row-to-Row Spacing | | 8.7 |
| Socket Style | | Mini DIMM |
| Socket Type | | Memory Card |
| Solder Tail Contact Plating | | Gold Flash over Nickel |