SpecificationsDocumentsDescriptionDimensions
| | |
Brand | | AMP |
Centerline | | 2.54 |
Contact Base Material | | Beryllium Copper |
Contact Plating Mating Area Material | | Gold (5) |
Contact Resistance | | 10.0 |
Contact Style | | Stamped + Formed |
Contact Termination Type | | Through Hole |
Frame Style | | Ladder |
Height Above PC Board | | 2.67 |
Insulation Resistance | | 5000.0 |
Lead Free Solder Processes | | Wave solder capable to 240°C / Wave solder capable to 260°C / Wave solder capabl |
Leg Style | | Straight |
Mating Contact Type | | Four-Fingered |
Mount Style | | Vertical |
Number of Positions | | 8 |
Packaging Method | | Tube |
Product Series | | 800 Series |
Profile | | Standard |
RoHSELV Compliance | | RoHS compliant / ELV compliant |
RoHSELV Compliance History | | Always was RoHS compliant |
Row-to-Row Spacing | | 7.62 |
Sleeve Material | | Brass |
Socket Style | | Standard |
Solder Tail Contact Plating | | Tin |
Temperature Range | | 125.0 |
Termination Post Length | | 3.18 |