SpecificationsDocumentsDescriptionDimensions
| Brand | | AMP |
| Centerline (mm in) | | 0.64 [0.025] |
| Contact Material | | Copper Alloy |
| Contact Mating Area Plating Material | | Gold (30) over Nickel |
| Gender | | Receptacle |
| Ground Bus Lead Length (mm (in)) | | 1.40 [0.055] |
| Ground Bus Lead Type | | Barbed |
| Ground Bus Material | | Phosphor Bronze |
| Ground Bus Mating Area Plating | | Gold (30) |
| Ground Bus Terminating Area | | Tin over Nickel |
| Housing Material | | Liquid Crystal Polymer (LCP) |
| Lead Free Solder Processes | | Reflow solder capable to 245°C, Reflow solder capable to 260°C |
| Mated Stack Height (Vertical) (mm in) | | 6.60 [0.260], 9.00 [0.354], 10.92 [0.430], 12.57 [0.495], 17.96 [0.707], 18.75 |
| Mount Angle | | Vertical |
| Number of Positions | | 266 |
| Packaging Method | | Tube |
| Product Type | | Connector |
| RoHSELV Compliance | | RoHS compliant, ELV compliant |
| RoHSELV Compliance History | | Always was RoHS compliant |
| Termination End Plating | | Tin over Nickel |
| Vacuum Cover | | Without |