SpecificationsDocumentsDescriptionDimensions
Brand | | AMP |
Centerline Matrix (mm (in)) | | 2.00 x 2.00 [.079 x .079] |
Comment | | Sequencing of the mating posts and lead lengths is available. Worksheets for th |
Contact Material | | Phosphor Bronze |
Contact Mating Area Plating Material | | Gold (30) |
Housing Material | | Liquid Crystal Polymer (LCP) |
Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
Mating Post Length (mm (in)) | | 5.00 [0.197] |
Module Type | | Signal |
Number of Rows | | 5 |
Number of Signal Positions | | 30 |
PCB Mount Angle | | Vertical |
Pin Header Width (mm (in)) | | 18.00 [0.709] |
Post Plating | | Tin Lead over Nickel |
Post Type | | Solder Post |
Product Type | | Fixed-Board (Header) |
RoHSELV Compliance | | ELV compliant, 5 of 6 Compliant |
Sequencing | | No |
Termination (Solder) Post Length (mm (in)) | | 4.25 [0.167] |
Voltage Rating (VAC) | | 30 |