SpecificationsDocumentsDescriptionDimensions
| Brand | | AMP |
| Centerline Matrix (mm (in)) | | 2.00 x 2.00 [.079 x .079] |
| Contact Material | | Phosphor Bronze |
| Contact Mating Area Plating Material | | Gold (30) |
| Housing Material | | Liquid Crystal Polymer (LCP) |
| Lead Free Solder Processes | | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
| Module Type | | Signal |
| Number of Rows | | 4 |
| Number of Signal Positions | | 192 |
| PCB Mount Angle | | Right Angle |
| Post Plating | | Tin |
| Post Type | | Solder Post |
| Product Type | | Free-Board (Receptacle) |
| RoHSELV Compliance | | RoHS compliant, ELV compliant |
| RoHSELV Compliance History | | Always was RoHS compliant |
| Sequencing | | No |
| Termination (Solder) Post Length (mm (in)) | | 2.73 [0.107] |
| Voltage Rating (VAC) | | 30 |